Diploma thesis for Erik Utne Poppe

Area of work: Microelectronics


Calibration and use of a silicon test chip to investigate reliability and thermal performance of flip-chip assembled multi-chip modules.

Description of the work

The reliability of flip-chip bonded circuits is limited by thermal expansion mismatch between chip and substrate. The strain which is introduced in the solder contacts will cause fatigue under thermal or power cycling, which may eventually lead to bond failure.

The aim of this work is to investigate the fatigue process by use of a silicon test chip containing structures for measuring stress, chip temperature and electrical continuity.

The work includes:

The work was carried out at SINTEF Instrumentation, Microelectronics section.